JPS6383178A - 導電塗料 - Google Patents

導電塗料

Info

Publication number
JPS6383178A
JPS6383178A JP22870386A JP22870386A JPS6383178A JP S6383178 A JPS6383178 A JP S6383178A JP 22870386 A JP22870386 A JP 22870386A JP 22870386 A JP22870386 A JP 22870386A JP S6383178 A JPS6383178 A JP S6383178A
Authority
JP
Japan
Prior art keywords
acid
resin
weight
metallic
examples
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP22870386A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0585588B2 (en]
Inventor
Kazumasa Eguchi
江口　一正
Fumio Nakaya
仲谷　二三雄
Shinichi Wakita
真一 脇田
Hisatoshi Murakami
久敏 村上
Tsunehiko Terada
恒彦 寺田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tatsuta Electric Wire and Cable Co Ltd
Original Assignee
Tatsuta Electric Wire and Cable Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tatsuta Electric Wire and Cable Co Ltd filed Critical Tatsuta Electric Wire and Cable Co Ltd
Priority to JP22870386A priority Critical patent/JPS6383178A/ja
Publication of JPS6383178A publication Critical patent/JPS6383178A/ja
Publication of JPH0585588B2 publication Critical patent/JPH0585588B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder

Landscapes

  • Paints Or Removers (AREA)
  • Conductive Materials (AREA)
JP22870386A 1986-09-26 1986-09-26 導電塗料 Granted JPS6383178A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22870386A JPS6383178A (ja) 1986-09-26 1986-09-26 導電塗料

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22870386A JPS6383178A (ja) 1986-09-26 1986-09-26 導電塗料

Publications (2)

Publication Number Publication Date
JPS6383178A true JPS6383178A (ja) 1988-04-13
JPH0585588B2 JPH0585588B2 (en]) 1993-12-08

Family

ID=16880480

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22870386A Granted JPS6383178A (ja) 1986-09-26 1986-09-26 導電塗料

Country Status (1)

Country Link
JP (1) JPS6383178A (en])

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5156771A (en) * 1989-05-31 1992-10-20 Kao Corporation Electrically conductive paste composition
US5158708A (en) * 1989-12-01 1992-10-27 Kao Corporation Conductive paste and conductive coating film
JP2008124030A (ja) * 2007-11-30 2008-05-29 Jsr Corp 導電性ペースト組成物、転写フィルムおよびプラズマディスプレイパネル
CN115295202A (zh) * 2022-07-06 2022-11-04 广州市儒兴科技股份有限公司 一种晶体硅太阳能电池正面银浆用有机载体及其制备方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5156771A (en) * 1989-05-31 1992-10-20 Kao Corporation Electrically conductive paste composition
US5158708A (en) * 1989-12-01 1992-10-27 Kao Corporation Conductive paste and conductive coating film
JP2008124030A (ja) * 2007-11-30 2008-05-29 Jsr Corp 導電性ペースト組成物、転写フィルムおよびプラズマディスプレイパネル
CN115295202A (zh) * 2022-07-06 2022-11-04 广州市儒兴科技股份有限公司 一种晶体硅太阳能电池正面银浆用有机载体及其制备方法

Also Published As

Publication number Publication date
JPH0585588B2 (en]) 1993-12-08

Similar Documents

Publication Publication Date Title
JP4935592B2 (ja) 熱硬化型導電性ペースト
JP2619289B2 (ja) 銅導電性組成物
EP0467575A2 (en) Electrically conductive copper composition
JP2965815B2 (ja) 半田付け可能な塗膜形成用導電性ペースト
JPH0753843B2 (ja) 半田付可能な導電塗料
JPH1064331A (ja) 導電ペースト、導電ペーストを用いた電気回路及び電気回路の製造法
JPS6383178A (ja) 導電塗料
JP2010090264A (ja) 機能性導電塗料とそれを用いた印刷配線板の製造方法
JPS62230869A (ja) 半田付可能な導電塗料
JPH0575027B2 (en])
JPH0240269B2 (en])
JP2628734B2 (ja) 導電ペースト
KR20120056885A (ko) 도금 링크로서 사용하기 위한 중합체 후막 은 전극 조성물
JPH0662900B2 (ja) 導電塗料
JP2001093330A (ja) スルーホール導体形成用導電ペースト及びその製造法並びにスルーホール導体形成用導電ペーストを用いた両面プリント配線板
JPH0619075B2 (ja) 半田付可能な導電塗料
JPH0436903A (ja) 銅系導電性ペースト
JPH0552862B2 (en])
JP2963518B2 (ja) 導電性ペースト組成物
JPH0415270A (ja) 導電ペースト
JPH04756B2 (en])
JP2003068139A (ja) 導電ペースト
JPS60260663A (ja) 導電性ペ−スト
JP2992958B2 (ja) 低温焼成多層配線基板用導体ペースト
JPH06338219A (ja) 導電ペースト